Vapor Chamber
Ultra-thin, Ultimate Cooling
Vapor Chamber utilizes phase-change heat transfer to rapidly and uniformly spread heat from point sources across the entire cooling surface, making it the ideal solution for high power density chip cooling.
Features
Ultra-thin Design
As thin as 0.3mm, perfect for slim devices
High Conductivity
Effective thermal conductivity over 10,000 W/(m·K), far exceeding copper and aluminum
Uniform Cooling
2D planar heat spreading eliminates hotspots, improving temperature uniformity by 60%
Customizable
Supports irregular shapes with complex structures and bending
Specifications
| Material | Copper / Aluminum / Composite |
| Thickness Range | 0.3mm - 5mm |
| Max Size | 300mm × 300mm |
| Working Fluid | DI Water / Acetone (per application) |
| Operating Temp | -40°C to 200°C |
| Thermal Resistance | < 0.1 °C/W (typical) |
| Lifespan | > 100,000 hours |
| Certifications | ISO9001 / RoHS / REACH |
Applications
High-performance CPU/GPU cooling
5G chip and baseband cooling
High-power LED thermal modules
Power semiconductors (IGBT/SiC) cooling
Portable electronic devices